Main facilities

Main technologies available in the Microtechnology lab for our partners and customers:

  • High temperature annealing, diffusion and oxidation
  • Rapid Thermal Treatment
  • Low Pressure Chemical Vapor Deposition of poly-Si, SiO2 and Si3N4 layers
  • Low Temperature Chemical Vapor Deposition
  • Ion implantation
  • Thin film depositions – Electron beam evaporation, DC and RF Sputtering
  • Atomic Layer Deposition
  • Deep Reactive Ion Etching
  • Photolithography with back-side alignment and Nanoimprinting
  • Wafer Bonding
  • Wet chemical treatments
  • Electro-chemical porous Silicon formation
  • Mask design, Pattern generator and Step-and-Repeat Camera
  • Electrical and functional characterizations