Main facilities
Main technologies available in the Microtechnology lab for our partners and customers:
- High temperature annealing, diffusion and oxidation
- Rapid Thermal Treatment
- Low Pressure Chemical Vapor Deposition of poly-Si, SiO2 and Si3N4 layers
- Low Temperature Chemical Vapor Deposition
- Ion implantation
- Thin film depositions – Electron beam evaporation, DC and RF Sputtering
- Atomic Layer Deposition
- Deep Reactive Ion Etching
- Photolithography with back-side alignment and Nanoimprinting
- Wafer Bonding
- Wet chemical treatments
- Electro-chemical porous Silicon formation
- Mask design, Pattern generator and Step-and-Repeat Camera
- Electrical and functional characterizations
Network services provided by the National Information Infrastructure Development Program.