Moore4Power: Europe’s mostambitious semiconductor R&D project

HUN: A Moore4Power (More than Moore for Disruptive Innovations in Power Electronics), Európa egyik legambiciózusabb félvezető K+F projektje, 2026 májusában indult. A Moore4Power projekt célja az intelligens, energiahatékony és fenntartható teljesítményelektronika következő generációjának fejlesztése fejlett félvezető technológiák, például szilícium, szilícium-karbid és gallium-nitrid kombinálásával nagymértékben integrált rendszerekké. Az Infineon Technologies AG által koordinált projekt célja Európa technológiai szuverenitásának megerősítése, miközben felgyorsítja az innovációt a megújuló energia, az e-mobilitás és az ipari alkalmazások terén. A HUN-REN EK MFA a 62 tagú konzorcium tagja.

The Moore4Power (More than Moore for Disruptive Innovations in Power Electronics), one of Europe’s most ambitious semiconductor R&D projects started in May 2026.

The Moore4Power project aims to develop the next generation of smart, energy-efficient and sustainable power electronics by combining advanced semiconductor technologies such as silicon, silicon carbide and gallium nitride into highly integrated systems. Coordinated by Infineon Technologies AG, the project seeks to strengthen Europe’s technological sovereignty while accelerating innovation for renewable energy, e-mobility and industrial applications.

HUN-REN EK MFA is part of the 62 members consortium.

PRESS RELEASE

Infineon launches EU flagship project Moore4Power to drive
the next generation of sustainable power electronics
– 62 European partners join forces to develop advanced smart power electronics
– more efficient, more robust and faster to industrialize
– Coordinated by Infineon, the project pioneers a More-than-Moore approach,
combining heterogeneous and functional integration beyond traditional scaling
– Moore4Power will be a key enabler for energy efficiency in renewable energy,
e-mobility and industrial applications

Munich, Germany – 20 May 2026 – Today marks the official launch of Moore4Power
(More than Moore for Disruptive Innovations in Power Electronics), one of Europe’s most
ambitious semiconductor R&D projects. Led by Infineon Technologies AG, a global leader
in power semiconductors, this Chips Joint Undertaking initiative unites large entities,
small and medium-sized enterprises and research institutes from 15 European countries
to develop the next generation of smart, efficient and sustainable power electronics. With
a total project volume of €91 million, Moore4Power will run for three years aiming to
deliver breakthrough innovations that strengthen Europe’s technological sovereignty and
sustainability in the field of power electronics.

For decades, progress in electronics followed Moore’s Law: smaller transistors, delivering
higher performance at lower cost. Today, traditional scaling is reaching physical and
economic limits. Moore4Power addresses this challenge by shifting the focus from
individual components to system-level innovation. Combining technologies, materials,
and functions in smarter, application-driven ways, the initiative unlocks major gains in
efficiency, reliability and power density.

“Power electronics are a decisive enabler for energy efficiency and sustainability. With
Moore4Power, we are setting the next level of smart integration to achieve significantly
higher energy and resource efficiency,” says Jochen Koszescha, Coordination Lead for
the Moore4Power project at Infineon Technologies AG. “We are proud to join forces
with an outstanding consortium from academia, research and industry to
make a decisive contribution to Europe’s Clean Industrial Deal.”

Smarter integration beyond traditional scaling
At the core of Moore4Power is heterogeneous integration, which combines different
semiconductor technologies such as silicon (Si), silicon carbide (SiC) and gallium nitride
(GaN), together with sensing, control and communication functions to form tightly
integrated systems. Each technology is used exactly where it performs best, enabling
higher efficiency, improved reliability and more compact designs. Power chiplet
technology enables scalable architectures and more flexible product variants at globally
competitive cost levels. This modular approach will pave the way for next-generation
solutions in a wide range of highly relevant applications. The foundation was laid in the
predecessor project PowerizeD, a large Chips JU-funded project completed in 2025,
which delivered outstanding advances in efficiency and reliability.

More performance for energy, mobility and industry
Moore4Power focuses on high-impact sectors where power conversion drives cost, CO₂
reduction and reliability. In wind energy, advanced power electronics can operate at the
core of turbines to improve energy conversion and increase harvested power; in
e-mobility, advanced power electronics will enable up to 99 percent efficiency with
near-loss-free, bidirectional charging; and in railway systems, they will cut propulsion
losses by at least 30 percent, significantly boosting energy efficiency.

Faster development through digital intelligence
Moore4Power not only innovates the product, it also reinvents the development process
itself. AI-assisted models, digital twins and automated workflows will be used to radically
shorten development cycles. Hardware and software will be designed in parallel to reduce
simulation time while increasing accuracy. As a result, the time from first fab samples to a
validated datasheet release can be reduced to just one week, compared to several weeks
today. This acceleration lowers costs, speeds up industrialization and strengthens
Europe’s industrial competitiveness. First scalable demonstrators will be tested under
real-word conditions.

Sustainability built in from the start
One central achievement is the Digital Product Passport (DPP), embedded directly into
power modules via wireless access. The DPP will provide lifecycle data such as operating
conditions, state of health and remaining lifetime throughout the product’s use. This
transparency will enable smarter maintenance, longer product lifetimes, better reuse and
reduced raw-material consumption – delivering substantial CO₂ savings and a concrete
contribution to Europe’s circular economy and climate goals.
EU cutting-edge research: 62 partners from 15 countries
The European project Moore4Power (More than Moore for Disruptive Innovations in
Power Electronics) will run for a total of three years. The project is co-funded by grants
from the participating countries and the Horizon Europe – Chips Joint Undertaking
(Innovation Action) program. The consortium in detail:
Austria: Austrian Institute of Technology GmbH | EV Group E. Thallner GmbH |
Hellpower Energy e.U. (HEPO) | Infineon Technologies Austria AG (IFAT) |
Kompetenzzentrum Automobil- und Industrieelektronik GmbH (KAI) | Silicon Austria Labs
GmbH (SAL); Belgium: Interuniversitair Micro-Electronica Centrum VZW (IMEC) |
Materialise NV (MATE) | Sadechaf BV (SADE); Czechia: i46 s.r.o. (i46) | Vysoké učení technické v Brně (BUT); Finland: Aalto-korkeakoulusäätiö sr (AALTO) | ABB Oy (ABB) |
Kempower Oy (KEMP) | Lappeenrannan–Lahden teknillinen yliopisto (LUT) | MSc
electronics Oy (MSC) | Vensum Power Oy (VENS); France: Ampère SAS (AMP) |
Commissariat à l’Énergie Atomique et aux Énergies Alternatives (CEA) | Institut
VEDECOM (VEDE) | SASU Rayione (RAY) | Trialog SAS (TRIA); Germany: Ansys
Germany GmbH (ANSYS) | Airbus Operations GmbH (A-D) | Finepower GmbH (FPG) |
Fraunhofer ENAS (FHG) | Hella GmbH & Co KGaA (HELLA) | Infineon Technologies AG
(IFAG) | Infineon Technologies Dresden AG & Co. KG (IFD) | Nano-Join GmbH (NANO) |
Ostbayerische Technische Hochschule Amberg-Weiden (OTH) | Technische Universität
Dortmund (TUDO) | Universität Bremen (UBRE); Greece: Innovation Dis.co Idiotiki
Kefalaiouchiki Etaireia (DISCO); Hungary: Budapesti Műszaki és Gazdaságtudományi
Egyetem (BME) | HUN-REN Energiatudományi Kutatóközpont (HUNREN) | Infineon
Technologies Cegléd (IFCE) | Spinsplit Műszaki Kutató Fejlesztő Kft. (SPIN); Italy:
Infineon Technologies Italia SRL (IFI) | Università degli Studi di Milano-Bicocca (UMIB) |
Università degli Studi di Padova (UNIPD); Latvia: Elektronikas un Datorzinātņu Institūts
(EDI); Netherlands: Prodrive Technologies Innovation Services B.V. (PTIS) | Signify
Netherlands B.V. (SIGN) | Technische Universiteit Delft (TUDE) | Technische Universiteit
Eindhoven (TUE) | Universiteit Twente (UTWEN) | VSL B.V. (VSL); Romania: Infineon
Technologies Romania & Co. SCS (IFRO) | Universitatea Tehnică din Cluj-Napoca
(UTCN); Spain: Consejo Superior De Investigaciones Científicas (CSIC) | Fagor
Automation S. Coop. (FAGOR) | Frenetic Electronics, S.L. (FREN) | Ingeteam Power
Technology S.A. (IPT) | Ingeteam Research Institute S.L. (IRI), Power Smart Control S.L.
(PSC) | Universidad de Oviedo (UNOVI); Sweden: Alstom Rail Sweden AB (ALST) |
Kungliga Tekniska högskolan (KTH) | Rise Research Institutes of Sweden AB (RISE);
Switzerland: ABB Schweiz AG (ABBCH) | Eidgenössische Technische Hochschule
Zürich (ETHZ) | Plexim GmbH (PLEXIM).
About Infineon
Infineon Technologies AG is a global semiconductor leader in power systems and IoT.
Infineon drives decarbonization and digitalization with its products and solutions. The
company had around 57,000 employees worldwide (end of September 2025) and
generated revenue of about €14.7 billion in the 2025 fiscal year (ending 30 September).
Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on
the OTCQX International over-the-counter market (ticker symbol: IFNNY).
Further information is available at www.infineon.com
This press release is available online at www.infineon.com/press
Follow us: Facebook – LinkedIn
Media contact:
Birgit Rader-Brunner
Tel.: +43 676 8205 7178; E-Mail: birgit.rader-brunner@infineon.com